Leaded Rosin Flux-Core Solder for Electronics 40% Tin, 460 Degree F Melting Temperature, 0.093" Diameter, 5 lbs.
Leaded Rosin Flux-Core Solder for Electronics 40% Tin, 460 Degree F Melting Temperature, 0.093" Diameter, 5 lbs.
Leaded Rosin Flux-Core Solder for Electronics 40% Tin, 460 Degree F Melting Temperature, 0.093" Diameter, 5 lbs.